Dreidimensionale Systemintegration: technologische Entwicklung und Anwendung

Abstract

Increasing demands on functionality of electrical systems lead to increasing complexity of integrated circuits. Thus, also the wiring density and wire length in interconnects is increasing which may lead to problems during manufacturing. This thesis deals with a new technological concept for the 3D integration of integrated circuits. Great emphasis is laid on developing low temperature processes, keeping the thermal budget low. Thus, the developed processes should be compatible with CMOS processing as well as with extremely temperature-sensitive substrate materials. As an example for transferability of the developed technology to other material systems, in this study a diamond-on-silicon UV sensor is 3D-integrated to a silicon base substrate and optically characterized.