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Dreidimensionale Systemintegration: technologische Entwicklung und Anwendung

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vts_6142_8274.pdf (8.453Mb)
167 Seiten
Veröffentlichung
2008-01-09
Authors
Kaiser, Alexander
Dissertation


Faculties
Fakultät für Ingenieurwissenschaften und Informatik
Abstract
Increasing demands on functionality of electrical systems lead to increasing complexity of integrated circuits. Thus, also the wiring density and wire length in interconnects is increasing which may lead to problems during manufacturing. This thesis deals with a new technological concept for the 3D integration of integrated circuits. Great emphasis is laid on developing low temperature processes, keeping the thermal budget low. Thus, the developed processes should be compatible with CMOS processing as well as with extremely temperature-sensitive substrate materials. As an example for transferability of the developed technology to other material systems, in this study a diamond-on-silicon UV sensor is 3D-integrated to a silicon base substrate and optically characterized.
Date created
2007
Original publication
Kaiser, Alexander: Dreidimensionale Systemintegration: technologische Entwicklung und Anwendung. Göttingen : Cuvillier Verl., 2007. ISBN-10: 3867274371 ; ISBN-13: 9783867274371
Subject headings
[GND]: Diamant | Dreidimensionale Integration | Integrierte Schaltung | Silicium
[LCSH]: Integrated circuits
[Free subject headings]: 3D-Kontakte | UV-Sensor
[DDC subject group]: DDC 620 / Engineering & allied operations
License
Standard (Fassung vom 03.05.2003)
https://oparu.uni-ulm.de/xmlui/license_v1

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DOI & citation

Please use this identifier to cite or link to this item: http://dx.doi.org/10.18725/OPARU-897

Kaiser, Alexander (2008): Dreidimensionale Systemintegration: technologische Entwicklung und Anwendung. Open Access Repositorium der Universität Ulm und Technischen Hochschule Ulm. Dissertation. http://dx.doi.org/10.18725/OPARU-897
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