| Author | Benkart, Peter | dc.contributor.author |
| Author | Munding, Andreas | dc.contributor.author |
| Author | Kaiser, Alexander | dc.contributor.author |
| Author | Kohn, Erhard | dc.contributor.author |
| Author | Heittmann, Arne | dc.contributor.author |
| Author | Huebner, Holger | dc.contributor.author |
| Author | Ramacher, Ulrich | dc.contributor.author |
| Date of accession | 2023-03-22T10:16:22Z | dc.date.accessioned |
| Available in OPARU since | 2023-03-22T10:16:22Z | dc.date.available |
| Date of first publication | 2007 | dc.date.issued |
| Language | en | dc.language.iso |
| Publisher | Universität Ulm | dc.publisher |
| Keyword | silicon fabrication technology | dc.subject |
| Keyword | microsystems | dc.subject |
| Keyword | 3D-stacking | dc.subject |
| Keyword | chip stack | dc.subject |
| Keyword | vertical integration | dc.subject |
| Keyword | through chip via | dc.subject |
| Keyword | SENSOR | dc.subject |
| Dewey Decimal Group | DDC 620 / Engineering & allied operations | dc.subject.ddc |
| Dewey Decimal Group | DDC 780 / Music | dc.subject.ddc |
| Title | Three-dimensional integration scheme with a thermal budget below 300 degrees C | dc.title |
| Resource type | Beitrag zu einer Konferenz | dc.type |
| Faculty | Fakultät für Ingenieurwissenschaften, Informatik und Psychologie | uulm.affiliationGeneral |
| Institution | Institut für Elektronische Bauelemente und Schaltungen | uulm.affiliationSpecific |
| DCMI Type | Text | uulm.typeDCMI |
| Category | Publikationsnachweise | uulm.category |
| DOI (external) | 10.1016/j.sna.2007.04.032 | dc.identifier.doiExternal |
| Source - Title of source | Sensors and Actuators A: Physical | source.title |
| Source - Publisher | Lausanne | source.publisherPlace |
| Source - Place of publication | Elsevier Science | source.publisher |
| Source - Volume | 139 | source.volume |
| Source - Issue | 1-2, SI | source.issue |
| Source - Year | 2007 | source.year |
| Source - From page | 350 | source.fromPage |
| Source - To page | 355 | source.toPage |
| Source - ISSN | 0924-4247 | source.identifier.issn |
| Source - eISSN | 1873-3069 | source.identifier.eissn |
| Conference name | 3rd Asia Pacific Conference of Transducers and Micro/Nano Technology | uulm.conferenceName |
| Conference place | Singapore | uulm.conferencePlace |
| Conference start date | 2006 | uulm.conferenceStartDate |
| Community | Universität Ulm | uulm.community |
| WoS | 000249678000053 | uulm.identifier.wos |
| Bibliography | uulm | uulm.bibliographie |
