Three-dimensional integration scheme with a thermal budget below 300 degrees C
Erstveröffentlichung
2007
Beitrag zu einer Konferenz
Published in
Sensors and Actuators A: Physical ; 139 (2007), 1-2, SI. - S. 350-355. - ISSN 0924-4247. - eISSN 1873-3069
Link to publication
https://dx.doi.org/10.1016/j.sna.2007.04.032Faculties
Fakultät für Ingenieurwissenschaften, Informatik und PsychologieInstitutions
Institut für Elektronische Bauelemente und SchaltungenConference
3rd Asia Pacific Conference of Transducers and Micro/Nano Technology, 2006, Singapore
Subject headings
[Free subject headings]: silicon fabrication technology | microsystems | 3D-stacking | chip stack | vertical integration | through chip via | SENSOR[DDC subject group]: DDC 620 / Engineering & allied operations | DDC 780 / Music