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AuthorGaller, Thomasdc.contributor.author
AuthorSchulz-Ruhtenberg, Maltedc.contributor.author
AuthorChaloun, Tobiasdc.contributor.author
AuthorWaldschmidt, Christiandc.contributor.author
Date of accession2022-11-29T09:17:25Zdc.date.accessioned
Available in OPARU since2022-11-29T09:17:25Zdc.date.available
Date of first publication2022-10-31dc.date.issued
AbstractA novel mechanically flexible filter integrated in a glass dielectric waveguide is presented for sensor applications at G-band (140–220 GHz). The use of laser-induced deep etching (LIDE) technology enables the production of via holes and thus the local modulation of the effective permittivity in a dielectric waveguide. This approach enables the implementation of a filter without the use of metal structures. In addition, extraordinary mechanical flexibility is achieved through meandering slots, which simultaneously perform the permittivity modulation. The RF performance was studied in full-wave simulations and validated by measurements of the manufactured bandstop prototypes. The experimental results of the implemented filter element show good agreement with the simulated values. At the center frequency of 156 GHz a notch depth below −14 dB in the measured stop band is achieved. Additional measurements show a stable filter characteristic at up to 8◦ bend angle applicable for the use as a low-loss waveguide under harsh environmental conditionsdc.description.abstract
Languageendc.language.iso
PublisherUniversität Ulmdc.publisher
LicenseLizenz Adc.rights
Link to license texthttps://oparu.uni-ulm.de/xmlui/licenseA_v1dc.rights.uri
Keyworddielectric waveguidedc.subject
KeywordTGVdc.subject
Dewey Decimal GroupDDC 620 / Engineering & allied operationsdc.subject.ddc
LCSHGlassdc.subject.lcsh
LCSHMillimeter wavesdc.subject.lcsh
TitleMechanically Flexible Dielectric Waveguides and Bandstop Filters in Glass Technology at G-banddc.title
Resource typeBeitrag zu einer Konferenzdc.type
VersionacceptedVersiondc.description.version
DOIhttp://dx.doi.org/10.18725/OPARU-46156dc.identifier.doi
URNhttp://nbn-resolving.de/urn:nbn:de:bsz:289-oparu-46232-3dc.identifier.urn
GNDFilterdc.subject.gnd
GNDGlasdc.subject.gnd
FacultyFakultät für Ingenieurwissenschaften, Informatik und Psychologieuulm.affiliationGeneral
InstitutionInstitut für Mikrowellentechnikuulm.affiliationSpecific
Peer reviewjauulm.peerReview
DCMI TypeTextuulm.typeDCMI
CategoryPublikationenuulm.category
DOI of original publication10.23919/EuMC54642.2022.9924350dc.relation1.doi
Source - Title of source2022 52nd European Microwave Conference (EuMC)source.title
Source - Place of publicationInstitute of Electrical and Electronics Engineers (IEEE)source.publisher
Source - Year2022source.year
Source - From page294source.fromPage
Source - To page297source.toPage
Source - ISBN978-2-8748-7069-9source.identifier.isbn
Source - ISBN978-1-6654-5881-8source.identifier.isbn
Conference name52nd European Microwave Conference (EuMC)uulm.conferenceName
Conference placeMilanuulm.conferencePlace
Conference start date2022-09-27uulm.conferenceStartDate
Conference end date2022-09-29uulm.conferenceEndDate
Open AccessGreen Submitteduulm.OA
Bibliographyuulmuulm.bibliographie
Project uulmGlaRA / Verbundprojekt: Glasinterposer-Technologie zur Realisierung hochkompakter Elektroniksysteme für Hochfrequenzanwendungen - GlaRA -; Teilvorhaben: Hochfrequenzkomponenten auf Glassubstraten / BMBF / 16ES0692uulm.projectOther


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