Author | Galler, Thomas | dc.contributor.author |
Author | Schulz-Ruhtenberg, Malte | dc.contributor.author |
Author | Chaloun, Tobias | dc.contributor.author |
Author | Waldschmidt, Christian | dc.contributor.author |
Date of accession | 2022-11-29T09:17:25Z | dc.date.accessioned |
Available in OPARU since | 2022-11-29T09:17:25Z | dc.date.available |
Date of first publication | 2022-10-31 | dc.date.issued |
Abstract | A novel mechanically flexible filter integrated in a
glass dielectric waveguide is presented for sensor applications at
G-band (140–220 GHz). The use of laser-induced deep etching
(LIDE) technology enables the production of via holes and thus
the local modulation of the effective permittivity in a dielectric
waveguide. This approach enables the implementation of a filter
without the use of metal structures. In addition, extraordinary
mechanical flexibility is achieved through meandering slots, which
simultaneously perform the permittivity modulation. The RF
performance was studied in full-wave simulations and validated
by measurements of the manufactured bandstop prototypes. The
experimental results of the implemented filter element show good
agreement with the simulated values. At the center frequency
of 156 GHz a notch depth below −14 dB in the measured stop
band is achieved. Additional measurements show a stable filter
characteristic at up to 8◦ bend angle applicable for the use as a
low-loss waveguide under harsh environmental conditions | dc.description.abstract |
Language | en | dc.language.iso |
Publisher | Universität Ulm | dc.publisher |
License | Lizenz A | dc.rights |
Link to license text | https://oparu.uni-ulm.de/xmlui/licenseA_v1 | dc.rights.uri |
Keyword | dielectric waveguide | dc.subject |
Keyword | TGV | dc.subject |
Dewey Decimal Group | DDC 620 / Engineering & allied operations | dc.subject.ddc |
LCSH | Glass | dc.subject.lcsh |
LCSH | Millimeter waves | dc.subject.lcsh |
Title | Mechanically Flexible Dielectric Waveguides and Bandstop Filters in Glass Technology at G-band | dc.title |
Resource type | Beitrag zu einer Konferenz | dc.type |
Version | acceptedVersion | dc.description.version |
DOI | http://dx.doi.org/10.18725/OPARU-46156 | dc.identifier.doi |
URN | http://nbn-resolving.de/urn:nbn:de:bsz:289-oparu-46232-3 | dc.identifier.urn |
GND | Filter | dc.subject.gnd |
GND | Glas | dc.subject.gnd |
Faculty | Fakultät für Ingenieurwissenschaften, Informatik und Psychologie | uulm.affiliationGeneral |
Institution | Institut für Mikrowellentechnik | uulm.affiliationSpecific |
Peer review | ja | uulm.peerReview |
DCMI Type | Text | uulm.typeDCMI |
Category | Publikationen | uulm.category |
DOI of original publication | 10.23919/EuMC54642.2022.9924350 | dc.relation1.doi |
Source - Title of source | 2022 52nd European Microwave Conference (EuMC) | source.title |
Source - Place of publication | Institute of Electrical and Electronics Engineers (IEEE) | source.publisher |
Source - Year | 2022 | source.year |
Source - From page | 294 | source.fromPage |
Source - To page | 297 | source.toPage |
Source - ISBN | 978-2-8748-7069-9 | source.identifier.isbn |
Source - ISBN | 978-1-6654-5881-8 | source.identifier.isbn |
Conference name | 52nd European Microwave Conference (EuMC) | uulm.conferenceName |
Conference place | Milan | uulm.conferencePlace |
Conference start date | 2022-09-27 | uulm.conferenceStartDate |
Conference end date | 2022-09-29 | uulm.conferenceEndDate |
Open Access | Green Submitted | uulm.OA |
Bibliography | uulm | uulm.bibliographie |
Project uulm | GlaRA / Verbundprojekt: Glasinterposer-Technologie zur Realisierung hochkompakter Elektroniksysteme für Hochfrequenzanwendungen - GlaRA -; Teilvorhaben: Hochfrequenzkomponenten auf Glassubstraten / BMBF / 16ES0692 | uulm.projectOther |