Advanced RF frontend technology using micromachined SiGe (ARTEMIS)
FacultiesFakultät für Ingenieurwissenschaften
LicenseStandard (Fassung vom 03.05.2003)
An attractive band is the 250 MHz wide 24 GHz ISM band, which is available globally without specific licenses. Bringing systems utilizing the upper microwave range into consumer applications is primarily a question of reducing cost. Traditional hybrid construction techniques, using GaAs-based semiconductor technologies as well as special high-performance packaging and assembly techniques are too expensive. Project ARTEMIS addressed the issue of reducing cost through the following measures: (1) the use of an inexpensive Si-based technology, with relaxed lateral scaling, which can be produced very inexpensively in large quantities; (2) micromachining techniques to combine specific microwave elements such as inductors with high quality factor and on-chip antenna structures with the Si-based semiconductor technology; (3) design approaches for highly integrated front-end ICs operating at 24 GHz, with specific layout techniques substantially reducing the chip size vs. traditional MMIC solutions; (4) suitable packaging techniques able to produce tightly integrated microwave subsystems which can be implemented into systems without specific microwave knowledge.
Subject HeadingsKostensenkung [GND]
Microelectronic packaging [LCSH]