Hermetically sealed glass package for highly integrated MMICs

peer-reviewed
Erstveröffentlichung
2019-11-25Authors
Galler, Thomas
Chaloun, Tobias
Kröhnert, Kevin
Schulz-Ruhtenberg, Malte
Waldschmidt, Christian
Beitrag zu einer Konferenz
Published in
2019 49th European Microwave Conference (EuMC) ; 2019 (2019). - S. 292-295. - ISBN 978-2-87487-055-2, ISBN 978-1-7281-1798-0
Link to original publication
https://dx.doi.org/10.23919/EuMC.2019.8910813Faculties
Fakultät für Ingenieurwissenschaften, Informatik und PsychologieInstitutions
Institut für MikrowellentechnikExternal cooperations
Fraunhofer IZMLPKF Laser & Electronics AG
Document version
accepted versionConference
49th European Microwave Conference (EuMC), 2019-09-29 - 2019-10-04, Paris
Abstract
A novel hermetically sealed RF packaging concept
based on glass is presented. Using the laser induced deep etching
(LIDE) technology enables the fabrication of glass vias without
degrading the mechanical stability as micro-cracks are completely
avoided. Furthermore, aspect ratios of up to 1:10 make this
technology superior over conventional packaging solutions for
the upper millimeter wave regime beyond 150 GHz. As an initial
design demonstration, this paper shows a vertical RF-transition
through the glass substrate using Through-Glass Vias (TGVs)
with an aspect ratio larger than 1:6. The realized prototypes
intended for highly efficient LO/VCO distribution within the
glass package show excellent reproducibility with a maximum
insertion loss of 0.4 dB up to 40 GHz. In addition, a very compact
RF-interconnection from PCB to the glass package using solder
balls is presented. The simulation of the RF-transition is in good
agreement with the measured reflection and transition coefficient
not exceeding −15 dB and −1.5 dB up to 35 GHz, respectively.
Subject headings
[GND]: Transitionssystem | MMIC | Gedruckte Schaltung[LCSH]: Millimeter waves
[Free subject headings]: Millimeter wave | transition | glass interposer | MMIC | PCB | TGV
[DDC subject group]: DDC 530 / Physics | DDC 620 / Engineering & allied operations
Metadata
Show full item recordDOI & citation
Please use this identifier to cite or link to this item: http://dx.doi.org/10.18725/OPARU-36759
Galler, Thomas et al. (2021): Hermetically sealed glass package for highly integrated MMICs. Open Access Repositorium der Universität Ulm und Technischen Hochschule Ulm. http://dx.doi.org/10.18725/OPARU-36759
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