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Hermetically sealed glass package for highly integrated MMICs

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Transition_oparu.pdf (2.206Mb)

peer-reviewed

Erstveröffentlichung
2019-11-25
Authors
Galler, Thomas
Chaloun, Tobias
Kröhnert, Kevin
Schulz-Ruhtenberg, Malte
Waldschmidt, Christian
Beitrag zu einer Konferenz


Published in
2019 49th European Microwave Conference (EuMC) ; 2019 (2019). - S. 292-295. - ISBN 978-2-87487-055-2, ISBN 978-1-7281-1798-0
Link to original publication
https://dx.doi.org/10.23919/EuMC.2019.8910813
Faculties
Fakultät für Ingenieurwissenschaften, Informatik und Psychologie
Institutions
Institut für Mikrowellentechnik
External cooperations
Fraunhofer IZM
LPKF Laser & Electronics AG
Document version
accepted version
Conference
49th European Microwave Conference (EuMC), 2019-09-29 - 2019-10-04, Paris
Abstract
A novel hermetically sealed RF packaging concept based on glass is presented. Using the laser induced deep etching (LIDE) technology enables the fabrication of glass vias without degrading the mechanical stability as micro-cracks are completely avoided. Furthermore, aspect ratios of up to 1:10 make this technology superior over conventional packaging solutions for the upper millimeter wave regime beyond 150 GHz. As an initial design demonstration, this paper shows a vertical RF-transition through the glass substrate using Through-Glass Vias (TGVs) with an aspect ratio larger than 1:6. The realized prototypes intended for highly efficient LO/VCO distribution within the glass package show excellent reproducibility with a maximum insertion loss of 0.4 dB up to 40 GHz. In addition, a very compact RF-interconnection from PCB to the glass package using solder balls is presented. The simulation of the RF-transition is in good agreement with the measured reflection and transition coefficient not exceeding −15 dB and −1.5 dB up to 35 GHz, respectively.
Subject headings
[GND]: Transitionssystem | MMIC | Gedruckte Schaltung
[LCSH]: Millimeter waves
[Free subject headings]: Millimeter wave | transition | glass interposer | MMIC | PCB | TGV
[DDC subject group]: DDC 530 / Physics | DDC 620 / Engineering & allied operations
License
Standard
https://oparu.uni-ulm.de/xmlui/license_v3

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DOI & citation

Please use this identifier to cite or link to this item: http://dx.doi.org/10.18725/OPARU-36759

Galler, Thomas et al. (2021): Hermetically sealed glass package for highly integrated MMICs. Open Access Repositorium der Universität Ulm und Technischen Hochschule Ulm. http://dx.doi.org/10.18725/OPARU-36759
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