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AuthorGeiger, Martindc.contributor.author
AuthorHitzler, Martindc.contributor.author
AuthorWaldschmidt, Christiandc.contributor.author
Date of accession2020-11-25T16:38:02Zdc.date.accessioned
Available in OPARU since2020-11-25T16:38:02Zdc.date.available
Date of first publication2020-10-14dc.date.issued
AbstractA variety of transitions from a monolithic microwave integrated circuit (MMIC) to a waveguide were proposed in literature to enable chip-to-chip links or to provide a standard interface. The MMIC is usually in contact with the waveguide and is therefore exposed to the mechanical stress exerted on the overall system. This paper presents mechanically decoupled transitions from MMIC to a rectangular waveguide and to a dielectric waveguide at G-Band (140 GHz to 220 GHz). Both transitions use a patch radiator on a quartz glass carrier as on-chip antenna. To focus the beam, a dielectric rod antenna or an elliptical dielectric lens is placed on the quartz glass. Since the transitions are mechanically decoupled, a second antenna is used as receive element. A horn antenna connected to the rectangular waveguide or a second dielectric lens connected to the dielectric waveguide is used. The transitions were characterized using a back end of line MMIC. The minimum measured insertion loss is 3.1 dB for the transition from MMIC to rectangular waveguide and 4.9 dB for the transition to dielectric waveguide.dc.description.abstract
Languageen_USdc.language.iso
PublisherUniversität Ulmdc.publisher
LicenseStandarddc.rights
Link to license texthttps://oparu.uni-ulm.de/xmlui/license_v3dc.rights.uri
KeywordMIMIC to waveguide transitiondc.subject
KeywordDielectric waveguidedc.subject
KeywordMechanical decouplingdc.subject
Dewey Decimal GroupDDC 620 / Engineering & allied operationsdc.subject.ddc
LCSHMicroelectronicsdc.subject.lcsh
LCSHAntennas (Electronics)dc.subject.lcsh
TitleMechanically decoupled transitions from MMIC to rectangular and dielectric waveguides at G-Banddc.title
Resource typeBeitrag zu einer Konferenzdc.type
VersionacceptedVersiondc.description.version
DOIhttp://dx.doi.org/10.18725/OPARU-33858dc.identifier.doi
URNhttp://nbn-resolving.de/urn:nbn:de:bsz:289-oparu-33920-6dc.identifier.urn
GNDMMICdc.subject.gnd
GNDHohlleiterdc.subject.gnd
FacultyFakultät für Ingenieurwissenschaften, Informatik und Psychologieuulm.affiliationGeneral
InstitutionInstitut für Mikrowellentechnikuulm.affiliationSpecific
Peer reviewjauulm.peerReview
DCMI TypeTextuulm.typeDCMI
CategoryPublikationenuulm.category
DOI of original publication10.1109/IMS30576.2020.9223986dc.relation1.doi
Source - Title of source2020 IEEE/MTT-S International Microwave Symposium (IMS)source.title
Quellenangabe - HerausgeberInstitute of Electrical and Electronics Engineerssource.contributor.editor1
Source - Place of publicationInstitute of Electrical and Electronics Engineerssource.publisher
Source - Volume2020source.volume
Source - Year2020source.year
Source - From page964source.fromPage
Source - To page967source.toPage
Source - eISSN2576-7216source.identifier.eissn
Source - ISBN978-1-7281-6815-9source.identifier.isbn
FundingZAFH Mikrosens / MWK BWuulm.funding
Conference nameInternational Microwave Symposiumuulm.conferenceName
Conference placeLos Angelesuulm.conferencePlace
Conference start date2020-08-04uulm.conferenceStartDate
Conference end date2020-08-06uulm.conferenceEndDate
Open AccessGreen Publisheduulm.OA
WoS000627746500582uulm.identifier.wos
Bibliographyuulmuulm.bibliographie


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