207-257 GHz Integrated Sensing Readout System with Transducer in a 130-nm SiGe BiCMOS Technology

Erstveröffentlichung
2019
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Authors
Wang, D.
Yun, J.
Eissa, M. H.
Kucharski, M.
Schmalz, K.
et al.
Faculties
Fakultät für Ingenieurwissenschaften, Informatik und Psychologie
Institutions
Institut für Elektronische Bauelemente und Schaltungen
Published in
2019 IEEE Mtt S International Microwave Symposium Digest. - New York, NY : Institute of Electrical and Electronics Engineers, 2019. - (IEEE MTT-S International Microwave Symposium). - S. 496-499. - ISBN 978-1-7281-1309-8. - ISSN 0149-645X. - eISSN 2576-7216
Conference
IEEE-MTT-S International Microwave Symposium (IMS), 2019-06-02 - 2019-06-07, Boston, MA
Funding information
project OCEAN12 from Electronic Component Systems for European Leadership Joint Undertaking
Forschungsgemeinschaft (DFG) Schwerpunktprogramme (SPP) under the ESSENCE project THz-LoCGerman Research Foundation (DFG) [C023CD17]
Keywords
THz-LoC; BiCMOS; transducer; resonator; readout circuit; dielectric sensor; SiGe
Dewey Decimal Group
DDC 620 / Engineering & allied operations
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