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207-257 GHz Integrated Sensing Readout System with Transducer in a 130-nm SiGe BiCMOS Technology

Erstveröffentlichung
2019
Authors
Wang, D.
Yun, J.
Eissa, M. H.
Kucharski, M.
Schmalz, K.
et al.
Beitrag zu einer Konferenz


Published in
2019 IEEE Mtt S International Microwave Symposium Digest. - New York, NY : Institute of Electrical and Electronics Engineers, 2019. - (IEEE MTT-S International Microwave Symposium). - S. 496-499. - ISBN 978-1-7281-1309-8. - ISSN 0149-645X. - eISSN 2576-7216
Faculties
Fakultät für Ingenieurwissenschaften, Informatik und Psychologie
Institutions
Institut für Elektronische Bauelemente und Schaltungen
Conference
IEEE-MTT-S International Microwave Symposium (IMS), 2019-06-02 - 2019-06-07, Boston, MA
Subject headings
[Free subject headings]: THz-LoC | BiCMOS | transducer | resonator | readout circuit | dielectric sensor | SiGe
[DDC subject group]: DDC 620 / Engineering & allied operations

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