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AuthorHu, Sanmingdc.contributor.author
AuthorWaldschmidt, Christiandc.contributor.author
AuthorChaloun, Tobiasdc.contributor.author
AuthorMenzel, Wolfgangdc.contributor.author
Date of accession2019-11-08T13:29:39Zdc.date.accessioned
Available in OPARU since2019-11-08T13:29:39Zdc.date.available
Date of first publication2016dc.date.issued
Languageen_USdc.language.iso
PublisherUniversität Ulmdc.publisher
Keyword3D transitiondc.subject
Keywordhorn antennadc.subject
Keywordmillimeter-wavedc.subject
Keywordco-designdc.subject
Keywordsystem-in-packagedc.subject
Dewey Decimal GroupDDC 620 / Engineering & allied operationsdc.subject.ddc
Title3D Transition between Thin and Thick Waveguides to Interconnect Chip and Antenna-in-Packagedc.title
Resource typeBeitrag zu einer Konferenzdc.type
FacultyFakultät für Ingenieurwissenschaften, Informatik und Psychologieuulm.affiliationGeneral
InstitutionInstitut für Mikrowellentechnikuulm.affiliationSpecific
DCMI TypeTextuulm.typeDCMI
CategoryPublikationsnachweiseuulm.category
DOI (external)10.1109/APCAP.2015.7374453dc.identifier.doiExternal
Source - Title of source2015 IEEE 4th Asia-Pacific Conference on Antennas and Propagation (APCAP)source.title
Quellenangabe - HerausgeberInstitute of Electrical and Electronics Engineerssource.contributor.editor1
Source - Place of publicationInstitute of Electrical and Electronics Engineerssource.publisher
Source - Volume2015source.volume
Source - Year2016source.year
Source - From page468source.fromPage
Source - To page469source.toPage
Source - ISBN978-1-4799-8897-6 978-1-4799-8896-9source.identifier.isbn
Conference name2015 IEEE 4th Asia-Pacific Conference on Antennas and Propagation (APCAP)uulm.conferenceName
Conference placeKuta, Indonesiauulm.conferencePlace
Conference start date2015-06-30uulm.conferenceStartDate
Conference end date2015-07-03uulm.conferenceEndDate
CommunityFakultät für Ingenieurwissenschaften, Informatik und Psychologieuulm.community
Bibliographyuulmuulm.bibliographie


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