3D Transition between Thin and Thick Waveguides to Interconnect Chip and Antenna-in-Package

Erstveröffentlichung
2016
Authors
Hu, Sanming
Waldschmidt, Christian
Chaloun, Tobias
Menzel, Wolfgang
Beitrag zu einer Konferenz


Published in
2015 IEEE 4th Asia-Pacific Conference on Antennas and Propagation (APCAP) ; 2015 (2016). - S. 468-469. - ISBN 978-1-4799-8897-6 978-1-4799-8896-9
Link to publication
https://dx.doi.org/10.1109/APCAP.2015.7374453
Faculties
Fakultät für Ingenieurwissenschaften, Informatik und Psychologie
Institutions
Institut für Mikrowellentechnik
Conference
2015 IEEE 4th Asia-Pacific Conference on Antennas and Propagation (APCAP), 2015-06-30 - 2015-07-03, Kuta, Indonesia
Subject headings
[Free subject headings]: 3D transition | horn antenna | millimeter-wave | co-design | system-in-package
[DDC subject group]: DDC 620 / Engineering & allied operations
Metadata
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