Browsing by Dewey Decimal Class "DDC 620 / Engineering & allied operations"
Now showing items 1-20 of 1454
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0.25-mu m BiCMOS System-on-Chip for K-/Ka-Band Satellite Communication Transmit-Receive Active Phased Arrays
Wissenschaftlicher Artikel(Universität Ulm, 2018)
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1.09-EV SCHOTTKY-BARRIER HEIGHT OF NEARLY IDEAL PT/AU CONTACTS DIRECTLY DEPOSITED ON N-AL0.48IN0.52AS AND P+N-AL0.48IN0.52AS LAYERS
Wissenschaftlicher Artikel(Universität Ulm, 1994)
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10 to 40 GHz Superheterodyne Receiver Frontend in 0.13 mu m SiGe BiCMOS Technology
Wissenschaftlicher Artikel(Universität Ulm, 2017)
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10GBIT/S DATA-TRANSMISSION USING TOP EMITTING VCSELS WITH HIGH SIDEMODE SUPPRESSION
Wissenschaftlicher Artikel(Universität Ulm, 1995)
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160-GHz radar proximity sensor with distributed and flexible antennas for collaborative robots
Wissenschaftlicher Artikel(Universität Ulm, 2019-01-09)There is a growing demand for collaborative robots in order to improve the efficiency of industrial processes and to push Industry 4.0 forward. The challenge for these robots is the compliance of the safety regulations to ... -
2.5 Gbit/s data link using oxidized sub mA threshold VCSELs
Beitrag zu einer Konferenz(Universität Ulm, 1996)
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2.5-Gb/s data transmission over 10-km standard single-mode fiber using InGaAsVCSEL's at 1.13-mu m emission wavelength
Wissenschaftlicher Artikel(Universität Ulm, 2000)
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2.5Gbit/s data transmission with singlemode GaAsVCSELs over-20 to 100 degrees C temperature range
Wissenschaftlicher Artikel(Universität Ulm, 2000)
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24 and 36 GHz SiGe HBT power amplifiers
Beitrag zu einer KonferenzWe present in this paper two amplifiers using the SiGe HBT technology, operating at 24 GHz and 36 GHz, respectively. The first amplifier was designed to operate in the 24 GHz ISM band, especially for traffic and automotive ... -
2D VCSEL arrays for chip-level optical interconnects
Beitrag zu einer Konferenz(Universität Ulm, 1999)
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3-dimensional chip integration: technology and critical issues
DissertationThe increasing integration density in monolithic circuit fabrication leads to a wiring problem. A solution offers the use of 3-dimensional chip integration with through chip vias. In this case, several highly interconnected ... -
3-Gb/s data transmission with GaAsVCSELs over PCB integrated polymer waveguides
Wissenschaftlicher Artikel(Universität Ulm, 2001)
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32-VCSEL channel CMOS-based transmitter module for Gb/s data rates
Beitrag zu einer Konferenz(Universität Ulm, 2001)
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33 - 43 GHz and 66 - 86 GHz VCO with high output power in an 80 GHz fT SiGe HBT technology
Beitrag zu einer KonferenzThis letter presents a signal generation circuit that combines a wide tuning range voltage controlled oscillator (VCO) and a frequency doubler. The VCO provides two differential outputs with different power levels. A ... -
3D Shape Reconstruction in Traffic Scenarios Using Monocular Camera and Lidar
Beitrag zu einer Konferenz(Universität Ulm, 2017)
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3D vehicle detection using a laser scanner and a video camera
Beitrag zu einer Konferenz(Universität Ulm, 2008)
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4.8 mW singlemode oxide confined top-surface emitting vertical-cavity laser diodes
Wissenschaftlicher Artikel(Universität Ulm, 1997)
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40-45 GHz High-IF Stage for Extremely Wide Tuning Range Receivers in 0.13 mu m SiGe BiCMOS
Beitrag zu einer Konferenz(Universität Ulm, 2017)